The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Jan. 17, 2022
Applicant:

Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai, CN;

Inventors:

Hui Zhang, Shanghai, CN;

Xuejian Liu, Shanghai, CN;

Jindi Jiang, Shanghai, CN;

Xiumin Yao, Shanghai, CN;

Zhengren Huang, Shanghai, CN;

Zhongming Chen, Shanghai, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/591 (2006.01); C04B 35/34 (2006.01); C04B 35/587 (2006.01); C04B 35/622 (2006.01); C04B 35/626 (2006.01); C04B 35/63 (2006.01); C04B 35/634 (2006.01); C04B 35/638 (2006.01); C04B 35/64 (2006.01); C09K 5/14 (2006.01);
U.S. Cl.
CPC ...
C04B 35/587 (2013.01); C04B 35/591 (2013.01); C04B 35/62218 (2013.01); C04B 35/6261 (2013.01); C04B 35/6264 (2013.01); C04B 35/62655 (2013.01); C04B 35/6303 (2013.01); C04B 35/6342 (2013.01); C04B 35/638 (2013.01); C04B 35/64 (2013.01); C09K 5/14 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3873 (2013.01); C04B 2235/428 (2013.01); C04B 2235/6025 (2013.01); C04B 2235/604 (2013.01); C04B 2235/606 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/6581 (2013.01); C04B 2235/6584 (2013.01); C04B 2235/661 (2013.01); Y10T 428/24355 (2015.01);
Abstract

A preparation method of a high-thermal-conductivity and net-size silicon nitride ceramic substrate includes the following steps: (1) mixing an original powder, a sintering aid, a dispersant, a defoamer, a binder, and a plasticizer in a protective atmosphere to allow vacuum degassing to obtain a mixed slurry; (2) subjecting the mixed slurry to tape casting and drying in a nitrogen atmosphere to obtain a first green body; (3) subjecting the first green body to shaping pretreatment to obtain a second green body; (4) subjecting the second green body to debonding at 500° C. to 900° C. to obtain a third green body; and (5) subjecting the third green body to gas pressure sintering in a nitrogen atmosphere at 1,800° C. to 2,000° C. to obtain the high-thermal-conductivity and net-size silicon nitride ceramic substrate.


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