Company Filing History:
Years Active: 2024-2025
Title: Innovations and Contributions of Inventor Xin Huang
Introduction
Xin Huang is a notable inventor based in Hefei, China. He has made significant contributions to the field of semiconductor technology and three-dimensional packaging. With a total of 3 patents to his name, his work reflects a commitment to advancing technological solutions.
Latest Patents
One of Xin Huang's latest patents is a bonding method for copper-copper metal using hydrazine hydrate. This method is particularly relevant in the technical field of three-dimensional packaging. It involves pretreating a copper-plated surface of a clean copper-plated substrate under a protective atmosphere, maintaining the temperature between 50° C. to 90° C. The process culminates in pressurized bonding at temperatures ranging from 200° C. to 300° C.
Another significant patent is a method, apparatus, and device for measuring semiconductor structures. This innovation provides a systematic approach to measuring a to-be-measured semiconductor structure by establishing reference structures and utilizing OCD measurement technology. This dual measurement process allows for the determination of structure parameters that align with both simulation models.
Career Highlights
Xin Huang has worked with prominent organizations such as Changxin Memory Technologies, Inc. and Anhui University. His experience in these institutions has contributed to his expertise in semiconductor technology and innovation.
Collaborations
Xin has collaborated with notable colleagues, including Wenhua Yang and Chao Xie. These partnerships have likely fostered a productive environment for innovation and research.
Conclusion
Xin Huang's contributions to the field of technology, particularly in semiconductor measurement and bonding methods, showcase his innovative spirit and dedication to advancing the industry. His work continues to influence the development of new technologies.