This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Huawei Technologies Co., Limited. Active years: 2023-2025.
Company Filing History:
Years Active: 2023-2025
Title: Innovations by Xiaoyun Wei
Introduction
Xiaoyun Wei is a prominent inventor based in Dongguan, China. She has made significant contributions to the field of chip packaging and heat dissipation technologies. With a total of 3 patents to her name, her work has garnered attention for its innovative approaches and practical applications.
Latest Patents
Xiaoyun Wei's latest patents include a chip package structure, a preparation method, and an electronic device. The chip package structure features a glass substrate, a routing layer, and multiple dies. The design enhances connection reliability between the die and the glass substrate while reducing signal transmission loss. Another patent focuses on a chip and its manufacturing method, which includes a die and a thermal conductive sheet. This innovation allows for efficient heat dissipation, ensuring that temperatures on the active surface of the die are evenly distributed, thus preventing performance issues.
Career Highlights
Xiaoyun Wei is currently employed at Huawei Technologies Co., Limited, where she continues to push the boundaries of technology. Her work is instrumental in advancing chip packaging and thermal management solutions, which are critical in modern electronic devices.
Collaborations
Xiaoyun has collaborated with notable colleagues, including Chaojun Deng and Yong Yang, contributing to a dynamic and innovative work environment.
Conclusion
Xiaoyun Wei's contributions to the field of chip technology exemplify her commitment to innovation and excellence. Her patents reflect a deep understanding of the challenges in electronic device design and offer practical solutions that enhance performance and reliability.