The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Aug. 27, 2021
Applicant:
Huawei Technologies Co., Ltd., Guangdong, CN;
Inventors:
Assignee:
HUAWEI TECHNOLOGIES CO., LTD., Guangdong, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/49827 (2013.01); H01L 24/11 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 24/73 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/11002 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/73204 (2013.01);
Abstract
Embodiments of the application provide a vertical interconnection structure and a manufacturing method thereof, a packaged chip, and a chip packaging method. Conductive pillars are formed on a first surface of a substrate. A first insulated support layer wrapping the conductive pillars is formed on the first surface of the substrate. The conductive pillars are located in the first insulated support layer. An upper surface of the conductive pillar that is away from the substrate is not covered by the first insulated support layer. Then the substrate is removed.