Shenzhen, China

Chaojun Deng

This inventor holds 12 USPTO granted patents and 4 published patent applications, plus 1 CIPO patent and 7 EPO patents. Top assignees: Huawei Technologies Co., Limited, Huawei Technologies Co., Ltd.. Active years: 2009-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chaojun Deng. Retrieved from https://idiyas.com/inventor/chaojun-deng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12 

% Patents Active = 91.7


 

Average Co-Inventor Count = 2.3

ph-index = 2

Forward Citations = 21(Granted Patents)


Location History:

  • Shenzhen, CN (2009 - 2021)
  • Dongguan, CN (2022 - 2024)

Company Filing History:


Years Active: 2009-2026

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12 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Chaojun Deng Revolutionizing Circuit Board Technology

Introduction:

Chaojun Deng, a prolific inventor based in the vibrant city of Shenzhen, CN, is making waves in the field of electronic communications technologies with his innovative solutions to heat dissipation challenges in circuit boards. With an impressive portfolio of 10 patents and a focus on enhancing electronic device performance, Deng is a trailblazer in the industry.

Latest Patents:

Deng's latest patents include a groundbreaking Circuit Board Assembly and Electronic Device. This assembly tackles the heat dissipation issue commonly faced by circuit boards by efficiently combining low-speed signals transmitted between various components and employing a smart transmission method using a low-speed cable. Additionally, his Chip and Manufacturing Method patent introduces a novel approach to chip heat dissipation, ensuring even temperature distribution and preventing local overheating that could affect chip functionality.

Career Highlights:

Currently working at Huawei Technologies Co., Limited, one of the leading global technology companies, Deng continues to drive innovation in electronic communications. His expertise in chip design and heat dissipation technologies has positioned him as a key figure in the industry, with a track record of developing cutting-edge solutions for complex electronic devices.

Collaborations:

Deng collaborates closely with talented individuals within his organization, including Jinhua Ye and Xiaoyun Wei. Their combined expertise and dedication to advancing technology have resulted in successful projects that push the boundaries of innovation in electronic communications technologies.

Conclusion:

In conclusion, Chaojun Deng's remarkable contributions to the field of electronic communications technologies, particularly in circuit board assembly and chip design, highlight his dedication to pushing the boundaries of innovation. With his inventive solutions and collaborative spirit, Deng continues to make a significant impact in the industry, paving the way for future advancements in electronic device performance and functionality.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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