Huawei Technologies Co., Limited

Chaojun Deng

Yong Yang

Bo Wang

Liming Fang

Cong Wang

Xiaoyun Wei

Wei Fang

Fei Ma

Zhiwen Yang

Chungang Li

Jinhua Ye

Shun Hao

Ziqiang Wang

Liankui Lin

Jiye Xu

Xiaoyu Tang

Xing Fu

Xiaorui Liu

Sheng Chu

A chip package structure includes a glass substrate, a routing layer, and a plurality of dies. A first surface of the glass substrate has solder joints and a second surface of the glass substrate has substrate solder balls. The routing layer is located in the glass substrate, and the solder joints are electrically connected to the substrate solder balls by using the routing layer. Each die has chip solder balls, is located on the first surface of the glass substrate, and the solder joints are bonded to the chip solder balls. The embodiments can improve connection reliability between the die and the glass substrate and can reduce a signal transmission loss.

Chip package structure, preparation method, and electronic device

A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.

Circuit board assembly and electronic device

Embodiments of this application provide a chip and a manufacturing method thereof, and an electronic device, and belong to the field of chip heat dissipation technologies. The chip includes a die and a thermal conductive sheet. An active surface of the die is connected to the thermal conductive sheet by using a first bonding layer. Heat generated at a part with a relatively high temperature on the active surface of the die can be quickly conducted and dispersed by using the thermal conductive sheet, so that temperatures on the active surface are evenly distributed to avoid an excessively high local temperature of the chip, thereby preventing running of the chip from being affected.

Chip and manufacturing method thereof, and electronic device

Embodiments of the application provide a vertical interconnection structure and a manufacturing method thereof, a packaged chip, and a chip packaging method. Conductive pillars are formed on a first surface of a substrate. A first insulated support layer wrapping the conductive pillars is formed on the first surface of the substrate. The conductive pillars are located in the first insulated support layer. An upper surface of the conductive pillar that is away from the substrate is not covered by the first insulated support layer. Then the substrate is removed.

Vertical interconnection structure and manufacturing method thereof, packaged chip, and chip packaging method

This application discloses a communications network and a related device. In one embodiment, the communications network includes a first optical line terminal and a second optical line terminal. The first optical line terminal is configured to send, through a first passive optical network (PON) interface based on a first PON protocol, a first optical signal to the at least one second optical line terminal. The second optical line terminal is configured to process the first optical signal and send through a second PON interface based on a second PON protocol, a processed first optical signal to at least one customer-premises equipment during downstream data transmissions, and process a second optical signal and send, through the first PON interface based on the first PON protocol, the processed second optical signal to the first optical line terminal during upstream data transmissions.

Communications network and related device

An ultrasonic wave-based voice signal transmission system, where the system includes an ultrasonic modulator, a beamforming controller, an ultrasonic transducer array, and a user detector. The ultrasonic modulator is configured to modulate a voice signal onto an ultrasonic band and output the modulated voice signal to the beamforming controller. The user detector is configured to detect a user and output a detection result of the user to the beamforming controller. The beamforming controller is configured to control according to the detection result from the user detector, a phase and amplitude of the modulated voice signal to obtain an electrical signal pointing to the user, and output, to the ultrasonic transducer array, the electrical signal pointing to the user. Therefore, call convenience can be improved for the user.

Ultrasonic wave-based voice signal transmission system and method

This invention discloses a method for smooth capacity expansion of data communication product, and a smooth capacity expandable system of data communication. Architecture of the system at least comprises circuit card and switched network card; and further comprises interface card of switched network, interface transfer card and connection optical fiber. Based on these, it provides one kind of multiple frameworks structure with interconnection between frameworks. When the capacity is expanded, the original circuit cards and switched network cards keep unchanged, only smoothly increases the switched network cards and numbers of circuit card frameworks. Therefore, it implements smooth capacity expansion and client investment protection at the same time. With adding backup cards, it also implements capacity expansion without interrupting the service.

Smooth capacity expansion method and system for data communication products

The present invention discloses a method and Ethernet device for clock synchronization, a method for clock synchronization in an entire Ethernet, and the relevant Ethernet. The method for clock synchronization in an Ethernet device includes: the PHY layer unit of the Ethernet device extracts a clock from the data sent by the receive unit; the MAC layer unit makes adjustments to the extracted clock according to the local clock and takes the adjusted clock as the transmit clock of the Ethernet device. The method for clock synchronization in an entire Ethernet includes: clocks of all Ethernet devices are synchronized to the clock generated by the Ethernet device at the highest level. The invention provides a method for clock synchronization so that sending and receiving of clocks in Ethernet devices can be synchronized and clock synchronization can be realized in the entire Ethernet.

Method, Ethernet device and Ethernet for clock synchronization

A system for implementing service switching includes a primary service processing unit, a physical interface card, a control center, a switching unit and a standby service processing unit, to guarantee that the physical interface card connected to the failed primary service processing unit transmits the service data that should be processed by the primary service processing unit to the standby service processing unit, and to control the control switching unit to transmit the service data that should be transmitted to the primary service processing unit to the standby service processing unit. A method for implementing service switching includes: managing the physical interface card to transmit the service data that should be processed by the primary service processing unit to the standby service processing unit, and managing the switching unit to transmit the service data that should be transmitted to the primary service processing unit to the standby service processing unit.

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Shenzhen, China

Chaojun Deng