Location History:
- Fremont, CA (US) (2004 - 2008)
- San Jose, CA (US) (2008)
Company Filing History:
Years Active: 2004-2008
Title: Innovations of Xiaowei Yao
Introduction
Xiaowei Yao is a prominent inventor based in Fremont, CA, known for his contributions to the field of optoelectronics and circuit packaging. With a total of 4 patents to his name, Yao has made significant advancements that enhance the efficiency and functionality of electronic components.
Latest Patents
Yao's latest patents include a circuit package and a method of plating the same. This innovative circuit package features a substrate with an opening, where a single unitary heat sink is positioned to effectively dissipate heat. The design allows for the top and bottom surfaces of the heat sink to be coplanar with those of the substrate. The selective plating method involves applying first and second metal patterns to a substrate surface, creating a voltage difference that facilitates the plating of the first metal pattern by attracting a specific metal type.
Another notable patent is the optical package fiber pass-through, which reduces the curvature of optical fibers during threading. This design includes one or more feed-throughs with a cutout, allowing optical fibers to be fed through more easily than traditional packages. The strategic placement of the cut enables fibers previously attached to components to pass through without excessive curvature, improving the overall performance of optoelectronic packages.
Career Highlights
Xiaowei Yao is currently employed at Intel Corporation, where he continues to innovate and develop cutting-edge technologies. His work at Intel has positioned him as a key player in the advancement of electronic packaging solutions.
Collaborations
Yao has collaborated with notable colleagues, including Marc A. Finot and Rickie Charles Lake, contributing to a dynamic and innovative work environment.
Conclusion
Xiaowei Yao's contributions to the field of electronics through his patents and work at Intel Corporation highlight his role as a leading inventor. His innovative designs and methods continue to shape the future of optoelectronic packaging and circuit technology.