Intel Corporation

Xiaowei Yao

Marc A Finot

Jeffrey A Bennett

Rickie Charles Lake

Robert Kohler

Tam Minh Nguyen

Marc Epitaux

Jean-Marc Verdiell

Charles E Askew

A circuit package includes a substrate having an opening and a single unitary heat sink adapted to effectively dissipate heat is positioned in the opening to expose top and bottom surfaces which are respectively coplanar with top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

Circuit package and method of plating the same

Optoelectronic packages with one or more feed-throughs having a cutout allow optical fibers that have been coupled to a component (e.g., an optical component, an electrical component, a structural component) to be fed through more easily than a package having feed-throughs without a cutout. In one embodiment, the cut in the feed-through is on the opposite side of the initial direction of the threading. That is, if the fiber is to come from above the feed-through, the cut is placed on the bottom of the feed-through. The placement of the cut on the feed-through allows a fiber previously attached to a component to be fed through without excessive curvature of the fiber.

Optical package fiber pass-through to reduce curvature of optical fiber during threading

A circuit package includes a base portion and a first metal pattern disposed on a substrate surface. Second and third metal patterns are disposed on another substrate surface, and electrically coupled to first and second vias. The third metal pattern forms a gap to electrically isolate it from the second metal pattern. A circuit package includes a substrate having an opening and a single heat sink positioned in the opening to expose top and bottom surfaces through top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

A low profile ringframe used in electro-optical module packaging is disclosed. The ringframe can be mounted so as to be set back from, be flush with, or be extending exteriorly over the outer end wall of the ceramic substrate, and may also be formed so as to help physically separate the ringframe-to-subtrate solder joint from the ringframe-to-laser weld seam. The ringframe, along the side where it is sealed to the adjacent substrate, can be notched with one or more cutout areas to allow a space for wicking of reflowed solder to prevent a built-up solder fillet from forming exteriorly of the ringframe.

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Fremont, CA, United States of America

Xiaowei Yao