The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2004
Filed:
May. 28, 2002
Rickie C. Lake, Sunnyvale, CA (US);
Xiaowei Yao, Fremont, CA (US);
Charles E. Askew, Mountain View, CA (US);
Marc Epitaux, Sunnyvale, CA (US);
Marc A. Finot, Palo Alto, CA (US);
Jeffrey A. Bennett, Sunnyvale, CA (US);
Robert M. Kohler, Mountain View, CA (US);
Jean-Marc Verdiell, Palo Alto, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A low profile ringframe used in electro-optical module packaging is disclosed. The ringframe can be mounted so as to be set back from, be flush with, or be extending exteriorly over the outer end wall of the ceramic substrate, and may also be formed so as to help physically separate the ringframe-to-subtrate solder joint from the ringframe-to-laser weld seam. The ringframe, along the side where it is sealed to the adjacent substrate, can be notched with one or more cutout areas to allow a space for wicking of reflowed solder to prevent a built-up solder fillet from forming exteriorly of the ringframe.