Company Filing History:
Years Active: 2004
Title: The Innovations of Charles E. Askew
Introduction
Charles E. Askew is a notable inventor based in Mountain View, CA (US). He has made significant contributions to the field of electronic and optical packaging. His innovative work has led to the development of a unique patent that addresses critical challenges in the industry.
Latest Patents
Charles E. Askew holds a patent titled "Methods of sealing electronic, optical and electro-optical packages and related package and substrate designs." This patent describes a low profile ringframe used in electro-optical module packaging. The ringframe can be mounted in various configurations, including set back from, flush with, or extending over the outer end wall of the ceramic substrate. Additionally, it is designed to physically separate the ringframe-to-substrate solder joint from the ringframe-to-laser weld seam. The design includes notches along the side where it is sealed to the adjacent substrate, allowing for the wicking of reflowed solder to prevent the formation of a built-up solder fillet exterior to the ringframe. Charles has 1 patent to his name.
Career Highlights
Charles E. Askew is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. His work at Intel has allowed him to explore and implement advanced packaging techniques that enhance the performance and reliability of electronic devices.
Collaborations
Throughout his career, Charles has collaborated with talented individuals such as Rickie Charles Lake and Xiaowei Yao. These collaborations have contributed to the advancement of technology in the field of electronic packaging.
Conclusion
Charles E. Askew's contributions to the field of electronic and optical packaging demonstrate his innovative spirit and dedication to advancing technology. His patent reflects a significant step forward in the design and functionality of electro-optical modules.