Robert Kohler

Title: The Innovative Contributions of Robert Kohler

Introduction

Robert Kohler is a prominent inventor based in Mountain View, California. He has made significant contributions to the field of circuit packaging and plating methods, holding a total of eight patents. His work is instrumental in advancing technology within the electronics industry.

Latest Patents

Kohler's latest patents include a circuit package and method of plating the same. This innovative circuit package features a substrate with an opening, where a single unitary heat sink is positioned to effectively dissipate heat. The design allows for the top and bottom surfaces of the heat sink to be coplanar with those of the substrate. The selective plating method involves applying first and second metal patterns to a substrate surface, creating a voltage difference that facilitates the plating of the first metal pattern. This process attracts a specific metal type to the voltage potential of the first metal pattern, which is lower than that of the metal source.

Career Highlights

Kohler is currently employed at Intel Corporation, where he continues to push the boundaries of innovation in circuit design and manufacturing. His expertise in selective plating and circuit packaging has positioned him as a key player in the development of advanced electronic components.

Collaborations

Throughout his career, Kohler has collaborated with notable colleagues, including Jean-Marc Verdiell and Marc A Finot. These partnerships have fostered a creative environment that encourages the exchange of ideas and technological advancements.

Conclusion

Robert Kohler's contributions to the field of electronics through his patents and work at Intel Corporation highlight his role as an influential inventor. His innovative approaches to circuit packaging and plating methods continue to shape the future of technology.