Intel Corporation

Robert Kohler

Jean-Marc Verdiell

Marc A Finot

Marc Epitaux

Jonas Webjorn

Jeffrey A Bennett

Rickie Charles Lake

Sylvain M Colin

Xiaowei Yao

Tam Minh Nguyen

Eric J Zbinden

Siva M Yegnanarayanan

Charles E Askew

Mark Epitaux

A circuit package includes a substrate having an opening and a single unitary heat sink adapted to effectively dissipate heat is positioned in the opening to expose top and bottom surfaces which are respectively coplanar with top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

Circuit package and method of plating the same

A circuit package includes a base portion and a first metal pattern disposed on a substrate surface. Second and third metal patterns are disposed on another substrate surface, and electrically coupled to first and second vias. The third metal pattern forms a gap to electrically isolate it from the second metal pattern. A circuit package includes a substrate having an opening and a single heat sink positioned in the opening to expose top and bottom surfaces through top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

A package is described. In one embodiment, the package includes multiple optical elements and multiple flexures, with at least one optical element attached to each flexure. The optical elements may be in alignment with each other. In an alternative embodiment, multiple optical elements are attached to a single flexure.

Optoelectronic assembly

Optoelectronic assembly having a flexure that supports multiple optical elements

A low profile ringframe used in electro-optical module packaging is disclosed. The ringframe can be mounted so as to be set back from, be flush with, or be extending exteriorly over the outer end wall of the ceramic substrate, and may also be formed so as to help physically separate the ringframe-to-subtrate solder joint from the ringframe-to-laser weld seam. The ringframe, along the side where it is sealed to the adjacent substrate, can be notched with one or more cutout areas to allow a space for wicking of reflowed solder to prevent a built-up solder fillet from forming exteriorly of the ringframe.

Methods of sealing electronic, optical and electro-optical packages and related package and substrate designs

Modern optoelectronic components have very tight coupling tolerances. Small misalignments of a strong lens that occur during the alignment and bonding process seriously degrade optical coupling. A weak lens is actively mounted using a flexure to correct misalignments of the strong lens. Since the weak lens does not exert as much steering force on a beam for a similar movement as the strong lens, misalignments that may occur during weak lens positioning and bonding do not appreciably degrade coupling.

Coupling with strong lens and weak lens on flexure

A method for aligning optical components includes positioning a flexure having an attached first optical component with respect to a substrate having a second optical component attached thereto. The flexure has at least two legs, and each leg has a foot portion. The method further includes coupling at least one leg of the two legs to the substrate at a point of contact between the foot portion of the at least one leg and the substrate. The method further includes adjusting the alignment of the optical components by spot welding a location on the leg. Spot welding on the substrate may also be used to adjust the alignment of the optical components.

Method for alignment of optical components using laser welding

A flexure and package including the same are provided. In one embodiment, the flexure is coupled to a second optical element and a substrate to maintain the second optical element in alignment with a first optical element. The flexure comprises a body, a pair of front and back legs. The attachment of the rear legs to the substrate causes the flexure to move from a first flexure position to a second flexure position, the distance between the first flexure position and the second flexure position equaling an offset distance. A specified length of the body is chosen such that the offset distance causes a second offset distance of the second optical component held by the flexure, and this second offset distance is within a specified range. The second offset distance is equal to the difference between a primary second optical component position and a secondary second optical component position.

Growing community of inventors

Mountain View, CA, United States of America

Robert Kohler