Xia Feng

Title: **Xia Feng: A Pioneer in Semiconductor Innovations**

Introduction

Xia Feng is a renowned inventor based in Singapore, SG, with an impressive portfolio of 24 patents to his name. His work primarily focuses on semiconductor devices and technologies that enhance their efficiency and functionality. He has significantly contributed to the evolution of the semiconductor industry through his innovative approaches.

Latest Patents

Xia Feng's latest patents showcase two groundbreaking inventions. The first patent is for a **semiconductor device and method of forming interconnect substrate for Fo-WLCSP**. This invention involves a sophisticated semiconductor device with a first encapsulant on a first carrier, where multiple conductive vias provide an interconnect substrate. The assembly includes mounting semiconductor dies and forming an interconnect structure that enables stackability in a PoP arrangement.

The second patent is centered on a **method of forming a sacrificial protective layer to protect semiconductor die edge during singulation**. In this innovative design, an insulating layer is applied over a semiconductor wafer containing several die separated by a saw street. A protective layer ensures that the edges of the semiconductor die are safeguarded during the singulation process, providing a unique solution for protecting semiconductor edges.

Career Highlights

Throughout his career, Xia Feng has worked with notable companies in the semiconductor realm, including Stats Chippac Pte. Ltd. and Jcet Semiconductor (Shaoxing) Co., Ltd. His professional journey reflects a dedication to advancing semiconductor technologies and a drive to improve manufacturing processes.

Collaborations

Collaborating with talented professionals in his field, Xia Feng has partnered with coworkers such as Yaojian Lin and Kang Chen. These collaborations have further enriched his innovative outputs, allowing for a fusion of ideas and expertise that enhances the impact of his inventions.

Conclusion

Xia Feng stands out as a leading figure in semiconductor innovation. His extensive patent portfolio and collaborative efforts exemplify his commitment to pushing the boundaries of technology. As he continues to contribute to advancements in this critical industry, his work will undoubtedly influence the future of semiconductor devices.