Location History:
- Seoul, KR (2002 - 2005)
- Gwanak-gu, KR (2007)
Company Filing History:
2 out of 1,009 
1 out of 832,843 Years Active: 2002-2007
Title: Innovations by Won Dai Shin
Introduction
Won Dai Shin is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on enhancing the efficiency and capacity of semiconductor packages, which are crucial components in modern electronics.
Latest Patents
Among his latest patents is a method for manufacturing a semiconductor package that involves applying photoresist layers to a metal plate. This innovative approach allows for the creation of a semiconductor package with increased capacity. The process includes several steps, such as patterning the photoresist layers, applying conductive layers, and encapsulating the semiconductor die with a package body. Another notable patent involves a saw and etch singulation method for chip packages, which improves the fabrication process of semiconductor packages from lead frame strips.
Career Highlights
Throughout his career, Won Dai Shin has worked with prominent companies in the semiconductor industry, including Amkor Technology, Inc. His experience in these organizations has contributed to his expertise in semiconductor packaging technologies.
Collaborations
Won Dai Shin has collaborated with several professionals in his field, including Tom Hu and Terry W. Davis. These collaborations have likely enriched his work and led to further innovations in semiconductor technology.
Conclusion
Won Dai Shin's contributions to semiconductor packaging through his patents and collaborations highlight his role as a significant inventor in the industry. His innovative methods continue to influence the development of efficient semiconductor packages.