The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
Jun. 19, 2002
Tom HU, Gilbert, AZ (US);
Terry W. Davis, Gilbert, AZ (US);
Ludovico E. Bancod, Chandler, AZ (US);
Won Dai Shin, Seoul, KR;
Tom Hu, Gilbert, AZ (US);
Terry W. Davis, Gilbert, AZ (US);
Ludovico E. Bancod, Chandler, AZ (US);
Won Dai Shin, Seoul, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A method of fabricating semiconductor packages from a lead frame strip which includes a mold cap applied to one side thereof, and defines a multiplicity of lead frames integrally connected to each other by connecting bars which extend in multiple rows and columns and define saw streets. In the singulation method of the present invention, the mold cap is sawed along the saw streets to expose the connecting bars. Thereafter, the connecting bars are chemically etched to separate the lead frames from each other.