Tom Hu

Title: Tom Hu - Innovator in Semiconductor Packaging

Introduction

Tom Hu is a notable inventor based in Gilbert, AZ (US), recognized for his contributions to semiconductor packaging technology. With a total of 2 patents, he has made significant advancements in the field, particularly in methods that enhance the efficiency and reliability of chip packages.

Latest Patents

Tom Hu's latest patents include innovative methods and designs that address common challenges in semiconductor packaging. One of his patents is titled "Saw and etch singulation method for a chip package." This method involves fabricating semiconductor packages from a lead frame strip, which includes a mold cap applied to one side. The process defines multiple lead frames connected by bars that extend in rows and columns, creating saw streets. In this singulation method, the mold cap is sawed along the saw streets to expose the connecting bars, which are then chemically etched to separate the lead frames.

Another significant patent is the "Semiconductor package with singulation crease." This invention describes an integrated circuit chip package that features a lead frame with an integrated circuit die electrically connected to it. The package body partially encapsulates the lead frame and die, with a central portion surrounded by a peripheral portion that has opposed top and bottom surfaces. A singulation crease is formed in the package body during the molding process, providing a stress concentration line that reduces stress along the edge of the chip package, thereby preventing chipping and cracking during the punch singulation process.

Career Highlights

Tom Hu is currently employed at Amkor Technology, Inc., where he continues to innovate in the semiconductor packaging sector. His work has contributed to the development of more reliable and efficient chip packaging solutions, which are crucial for the advancement of electronic devices.

Collaborations

Throughout his career, Tom has collaborated with talented professionals, including Terry W. Davis and Ludovico Estrada Bancod. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Tom Hu's contributions to semiconductor packaging through his innovative patents and collaborative efforts highlight his role as a key inventor in the industry. His work not only enhances the reliability of electronic devices but also paves the way for future advancements in semiconductor technology.