The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2003
Filed:
Oct. 12, 2001
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
An integrated circuit chip package comprising a lead frame having an integrated circuit die electrically connected thereto. Partially encapsulating the lead frame and the integrated circuit die is a package body. The package body includes the central portion which is circumvented by a peripheral portion defining opposed top and bottom surfaces. Disposed in at least one of the top and bottom surfaces of the peripheral portion of the package body is a singulation crease. The singulation crease, which is formed in the package body during its molding process, is used to provide a stress concentration line which reduces stress along the edge of the chip package and avoids chipping and cracking problems during the punch singulation process used to complete the manufacture of the same.