Wolfgang Appel

Title: Wolfgang Appel: Innovator in Semiconductor Technology

Introduction

Wolfgang Appel is a notable inventor based in Schwieberdingen, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His work focuses on methods for producing thin chips that incorporate integrated circuits.

Latest Patents

Wolfgang Appel's latest patents include innovative methods for producing thin chips. One of his patents describes a method for producing a very thin chip that includes an integrated circuit. In this method, a circuit structure is created in a defined section of a semiconductor wafer. The defined wafer section is then released from the semiconductor wafer by severing local web-like connections that hold it in place. Another patent outlines a method for producing a thin semiconductor chip, where a cavity is created under a defined section of the first surface of a semiconductor wafer using porous silicon. A circuit structure is produced in this section, and the wafer section is subsequently released by severing the connections that hold it above the cavity.

Career Highlights

Throughout his career, Wolfgang Appel has worked with prominent organizations in the semiconductor industry. He has been associated with the Institute for Microelectronics Stuttgart and Robert Bosch GmbH. His experience in these companies has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Wolfgang Appel has collaborated with notable professionals in his field, including Joachim N. Burghartz and Martin Zimmermann. These collaborations have likely enhanced his work and contributed to the advancements in semiconductor technology.

Conclusion

Wolfgang Appel is a distinguished inventor whose work in semiconductor technology has led to innovative methods for producing thin chips with integrated circuits. His contributions continue to impact the industry positively.