The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2011
Filed:
Sep. 11, 2008
Joachim N. Burghartz, Leinfelden-Echterdingen, DE;
Martin Zimmermann, Stuttgart, DE;
Wolfgang Appel, Schwieberdingen, DE;
Joachim N. Burghartz, Leinfelden-Echterdingen, DE;
Martin Zimmermann, Stuttgart, DE;
Wolfgang Appel, Schwieberdingen, DE;
Institut fuer Mikroelektronik Stuttgart, Stuttgart, DE;
Abstract
In a method for producing a thin film chip including an integrated circuit, a semi-conductor wafer having a first surface is provided. At least one cavity is produced under a defined section of the first surface by means of porous silicon. A circuit structure is produced in the defined section. The defined wafer section is subsequently released from the semiconductor wafer by severing local web-like connections, which hold the wafer section above the cavity and on the remaining semiconductor wafer.