logo

For the Inventor, By the Inventor

Lancaster, MA, United States of America

William R Halleck

USPTO Granted Patents = 20 

 

Average Co-Inventor Count = 4.6

ph-index = 5

Forward Citations = 104(Granted Patents)


Company Filing History:

goldMedal19 out of 54,780 
 
Intel Corporation
 patents
silverMedal1 out of 4 
 
Inter Corporation
 patents

Years Active: 2008-2024

Loading Chart...
Loading Chart...
20 patents (USPTO):Explore Patents
1. 11899615 - Multiple dies hardware processors and methods (2024-02-13),
2. 11586579 - Multiple dies hardware processors and methods (2023-02-21),
3. 11354264 - Bimodal PHY for low latency in high speed interconnects (2022-06-07),
4. 11294852 - Multiple dies hardware processors and methods (2022-04-05),
5. 10963415 - Bimodal PHY for low latency in high speed interconnects (2021-03-30),
6. 10931329 - High speed interconnect with channel extension (2021-02-23),
7. 10795853 - Multiple dies hardware processors and methods (2020-10-06),
8. 10599602 - Bimodal phy for low latency in high speed interconnects (2020-03-24),
9. 10372657 - Bimodal PHY for low latency in high speed interconnects (2019-08-06),
10. 10324882 - High performance interconnect link state transitions (2019-06-18),
11. 10152446 - Link-physical layer interface adapter (2018-12-11),
12. 10025746 - High performance interconnect (2018-07-17),
13. 9910809 - High performance interconnect link state transitions (2018-03-06),
14. 8135869 - Task scheduling to devices with same connection address (2012-03-13),
15. 7797463 - Hardware assisted receive channel frame handling via data offset comparison in SAS SSP wide port applications (2010-09-14),

Title: Innovator Spotlight: William R Halleck - Revolutionizing Hardware Processors

Introduction:

William R Halleck, a prolific inventor based in Lancaster, MA (US), has left an indelible mark on the tech industry with his groundbreaking innovations. With an impressive portfolio of 20 patents under his belt, Halleck is recognized for his contributions to the field of hardware processors.

Latest Patents:

Among his recent patents is the cutting-edge invention titled "Multiple Dies Hardware Processors and Methods," which explores advancements in hardware processors featuring multiple interconnected dies. This technology showcases a hardware processor comprising physically separate dies and an interconnect to seamlessly link these dies together, underscoring Halleck's expertise in optimizing processor performance.

Career Highlights:

Halleck's distinguished career includes tenure at renowned companies such as Intel Corporation and Inter Corporation, where he sharpened his skills and honed his craft. His innovative spirit and dedication to excellence have been instrumental in shaping the landscape of modern technology.

Collaborations:

Throughout his career, Halleck has collaborated with esteemed professionals in the industry, including Venkatraman Iyer and Rahul R Shah. These synergistic partnerships have fostered creativity and propelled the development of cutting-edge technologies, solidifying Halleck's reputation as a visionary inventor.

Conclusion:

In conclusion, William R Halleck stands as a trailblazing inventor whose ingenuity has redefined the possibilities within the realm of hardware processors. His relentless pursuit of innovation and his commitment to pushing the boundaries of technology continue to inspire the next generation of inventors and innovators worldwide.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…