Company Filing History:
9 out of 993 
1 out of 832,843 Years Active: 2005-2011
Title: The Innovations of William Crew
Introduction
William Crew is a notable inventor based in Portland, OR (US), recognized for his contributions to semiconductor technology. With a total of 10 patents, he has made significant advancements in the field, particularly in the development of copper diffusion barrier films and methods for repairing low-k dielectrics.
Latest Patents
One of Crew's latest patents involves low-K SiC copper diffusion barrier films. These films are designed to have low dielectric constants, making them suitable for various copper/inter-metal dielectric integration schemes. The films consist of one or more layers of silicon carbide, with at least one layer containing a composition of at least 40% carbon. This high carbon-content layer enhances the films' performance by reducing the effective dielectric constant compared to conventional barrier materials.
Another significant patent focuses on UV treatment for carbon-containing low-k dielectric repair in semiconductor processing. This method addresses process-induced damage by utilizing ultraviolet radiation to repair the carbon-containing low-k dielectric layer. The process is particularly beneficial in damascene processing, where trenches are formed in the dielectric layer. The UV treatment, optionally combined with a gas phase source of -CH groups, effectively repairs damage caused during trench formation and subsequent planarization operations.
Career Highlights
Throughout his career, William Crew has worked with various companies, including Novellus Systems Incorporated. His work has significantly impacted the semiconductor industry, particularly in enhancing the reliability and performance of semiconductor devices.
Collaborations
Crew has collaborated with notable professionals in the field, including Yongsik Yu and Karen Billington. These collaborations have contributed to the advancement of technologies related to semiconductor processing and materials.
Conclusion
William Crew's innovative work in semiconductor technology, particularly in the development of copper diffusion barrier films and repair methods for low-k dielectrics, showcases his significant contributions to the field. His patents reflect a commitment to advancing technology and improving semiconductor device performance.