William C Layer

Title: The Innovations of William C Layer

Introduction

William C Layer is a notable inventor based in Boise, ID (US), recognized for his contributions to the field of automated testing systems. With a total of 10 patents to his name, Layer has made significant advancements in technology that enhance the efficiency of multi-chip module handling.

Latest Patents

One of Layer's latest patents is the Automated Multi-Chip Module Handler and Testing System. This innovative system employs a module feed with multiple stackable magazines. The leading magazine in the input stack is positively displaced through an indexing device, which retrieves each multi-chip module (MCM) and guides it to a test site. The test site features a mechanism for engaging and aligning each MCM before it is tested. Additionally, the system includes a module locator bar with alignment pins that can be replaced to accommodate differently configured MCMs. Another aspect of this invention is the ability to eject tested MCMs for sorting along an inclined track to either a shipping tray or a discard bin. This comprehensive approach to module handling showcases Layer's ingenuity in automating complex processes.

Career Highlights

Throughout his career, William C Layer has worked with prominent companies such as Micron Technology Incorporated and Micron Semiconductor, Inc. His experience in these organizations has undoubtedly contributed to his expertise in the field of semiconductor technology and automated systems.

Collaborations

Layer has collaborated with notable individuals in the industry, including Mark A Tverdy and Lothar R Kress. These partnerships have likely fostered innovation and the exchange of ideas, further enhancing the impact of his work.

Conclusion

William C Layer's contributions to automated testing systems and multi-chip module handling reflect his dedication to innovation in technology. His patents and career achievements underscore his role as a significant figure in the field.