Micron Technology Incorporated

Micron Semiconductor, Inc.

William C Layer

Mark A Tverdy

Eric M Matthews

Lothar R Kress

Leland R Nevill

Steven L Hamren

Gregory A Barnett

Arthur T Jones, Jr

Refugio C Morales

Glenn S Thayer

Deanna K Wirz

William R Grant

An automated multi-chip module (MCM) handler for automated module testing which employs a module feed employing a plurality of stackable magazines, the leading one of which in an input stack is positively displaced through an indexing device which positively retrieves each MCM and guides it to a test site. The test site includes a mechanism for positively engaging and aligning each MCM before engagement by the associated test contacts. In one embodiment, the test site includes a module locator bar having a first arrangement of alignment pins configured for engagement with a plurality of tooling holes formed in an MCM presented at the test site. The module locator bar may be configured to be replaceable with a second module locator bar having a second, different arrangement of alignment pins such that differently configured MCMs may be accommodated and positively aligned at the test site.

Automated multi-chip module handler and testing system

An automated multi-chip module (MCM) handler for automated module testing which employs a module feed employing a plurality of stackable magazines, the leading one of which in an input stack is positively displaced through an indexing device which positively retrieves each MCM, guides it at a test site, and positively ejects a tested MCM from the test site for sort and direction along an inclined track to either a shipping tray or a discard bin. After a magazine is emptied of MCMs, it continues to an output location where it is stacked with other empty magazines. The test site includes a mechanism for positively engaging and aligning each MCM before engagement by the test contacts. A particularly suitable magazine for use with the handler is also disclosed, as is a method of module handling.

A magazine for carrying a plurality of multi-chip modules (MCMs) in association with an automated MCM handler for automated module testing. The magazine includes a body defining a plurality of mutually parallel receptacles extending between two opposing body sides, each body side having a different height relative to the height of the receptacles. Each receptacle is separated from an adjacent receptacle by a baffle member. At least one notch ins formed in each baffle member so as to form at least one row of aligned notches extending across and contiguous with each receptacle. The aligned row of notches is configured to receive an elongated element for effectively altering the length of each receptacle. At least one recess is formed in an underside of the magazine and transversely intersects each receptacle. The magazine may also include structure to accommodate vertical stacking of the magazine with a plurality of like magazines.

Magazine for carrying a plurality of multi-chip modules

An automated method of handling multi-chip modules (MCMs) in conjunction with automated module testing. The method includes providing a plurality of MCMs in a magazine at an input location and positively displacing the magazine through an indexing device. At the indexing device, the MCMs are each positively retreived and guided to a test site, tested, and positively ejected for sorting according to the results of the testing. Depending on the testing results, the MCMs may be placed in a shipping tray or in a discard bin. The emptied magazine is further displaced to an output location where it may be stacked with similar emptied magazines.

Automated multi-chip module handler, method of module handling, and module magazine

An automated multi-chip module (MCM) handler for automated module testing which employs a module feed employing a plurality of stackable magazines, the leading one of which in an input stack is positively displaced through an indexing device which positively retrieves each MCM, guides it at a test site, and positively ejects a tested MCM from the test site for sort and direction along an inclined track to either a shipping tray or a discard bin. After a magazine is emptied of MCMs, it continues to an output location where it is stacked with other empty magazines. The test site includes a mechanism for positively engaging and aligning each MCM before engagement by the test contacts.

An apparatus for processing an integrated circuit device comprises at least one insert having at least one beveled hole therein, the insert adapted to receive at least one semiconductor device. The apparatus further includes a tray having a pocket for receiving the insert and a slot, a deformable segment on the insert, and at least three posts on the insert. Further included is at least one tab on the deformable segment with one of the slots receiving the tab. The slot in the tray and the tab on the insert movably attaches the insert to the tray, the insert being self-aligning to a processing apparatus thereby in conjunction with the posts and allowing for removal of the insert from the pocket.

Tray for processing and/or shipping integrated circuit device

An apparatus for processing an integrated circuit device comprises at least one insert having at least one beveled hole therein, the insert adapted to receive at least one semiconductor device. The apparatus further includes a tray having a pocket for receiving the insert and a slot, a deformable segment on the insert, and at least three posts on the insert. Further included is at least one tab on the deformable segment with one of the slots receiving the tab. The slot in the tray and the tab on the insert movably attaches the insert to the tray, the insert being self-aligning to a processing apparatus thereby in conjunction with the posts and allowing for removal of the insert from the pocket

Method for processing and/or shipping integrated circuit devices

The inventive apparatus is to provide rapid, automatic separation, classification and operator assisted dispensation of integrated circuit assemblies from burn-in and device under test boards to which they are attached. The apparatus is computer controlled, with an electronic control panel, and is assembled to differentiate between and separate physically acceptable and unacceptable integrated circuit assemblies and deliver, by means of a suitable reservoir, the acceptable assemblies to appropriate carrier tubes for further processing or shipping. The system uses an indexing table to move an inverted device under test board across an array of assembly extraction fingers which remove attached integrated circuit assemblies from the sockets of the test board and drop them into a reservoir. The reservoir is slotted to receive the individual assemblies and dispense them into carrier tubes. Several position sensing means are included in the system to provide automatic control of the indexing table, the assembly extraction fingers and the reservoir during the operation of the system.

Burn-in board LIF unloader system and method

The inventive apparatus provides for the automated marking, inspecting and handling of a variety of singulated integrated circuit devices. The apparatus includes a computerized high speed vision system with operator touchscreen interface control of a novel series of electrical and mechanical operations to automatically receive integrated circuit devices from a suitable bulk input supply and sequentially inspect, align, mark, inspect, accept or reject, cure and discharge into a suitable bulk output supply, a high volume of properly marked integrated circuit devices, packaged and ready for shipment.

Integrated circuit marking and inspecting system

The inventive apparatus automatically processes symmetrical supply tubes used in the storage and handling of semiconductor integrated circuit packages, IC. Unlike prior art methods which rely on the asymmetrical quality of the A-tube, the invention processes symmetrical, rectangular tubes to a point where the contents are discharged to a desired orientation. The invention operates to manipulate the symmetrical supply tubes from a gravity bin to a standing position wherein each tube is at rest on one of its two narrow sides. The tubes are then singulated, moved, and tilted to a position where the leading ICs are discharged to a short distance outside the tube. The IC are held on side in either a lead left or lead right position and are sensed to determine their orientation. Upon determination of the lead left or lead right orientation, the sort block is appropriately placed and the IC are released. The IC are reoriented as they stream through one of two geometrically shaped voids of the sort block onto a part track.

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Boise, ID, United States of America

William C Layer