Shanghai, China

Wenyu Liu

This inventor holds 23 USPTO granted patents and 1 published patent application, primarily in Thermal Management. Top assignees: Tyco Electronics (Shanghai) Co., Ltd., Te Connectivity Corporation, Te Connectivity Services Gmbh. Active years: 2016-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wenyu Liu. Retrieved from https://idiyas.com/inventor/wenyu-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 91.3

Average Co-Inventor Count = 4.8

ph-index = 4

Forward Citations = 59(Granted Patents)


Company Filing History:


Years Active: 2016-2025

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Areas of Expertise:
Thermal Transport
Heat Sink
Connector Assembly
Receptacle Assembly
Electrical Equipment
Cage Assembly
Clamping Mechanism
Electromagnetic Leakage
Connector Housing
Shielding Cage
Radiator
Electronic Module
23 patents (USPTO):Explore Patents

Title: Wenyu Liu - Innovator from Shanghai, CN

Introduction: Wenyu Liu is a renowned inventor hailing from Shanghai, China, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Wenyu Liu holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to creating solutions for the future.

Career Highlights: With a career spanning over two decades, Wenyu Liu has worked with leading tech companies and research institutions, where he has spearheaded projects that have revolutionized industries.

Collaborations: Throughout his career, Wenyu Liu has collaborated with top scientists, engineers, and researchers globally, fostering a culture of innovation and knowledge-sharing.

Conclusion: Wenyu Liu's passion for innovation and his dedication to creating a sustainable future through technology make him a visionary inventor in the global landscape of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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