The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Sep. 30, 2019
Applicants:

Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;

Tyco Electronics Amp Guangdong Ltd, Foshan, CN;

Inventors:

WenYu Liu, Shanghai, CN;

Hongqiang Han, Shanghai, CN;

Jinsheng Lai, Foshan, CN;

Yan Lee, Shanghai, CN;

Lei Liu, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 3/04 (2006.01); H01R 13/46 (2006.01); H01R 12/58 (2011.01); H01R 13/6581 (2011.01);
U.S. Cl.
CPC ...
F28F 3/04 (2013.01); H01R 12/58 (2013.01); H01R 13/46 (2013.01); H01R 13/6581 (2013.01); F28F 2280/00 (2013.01);
Abstract

A heat sink includes a heat sink body having a plurality of stacked fins and a mounting base including a heat dissipation plate. A first surface of the heat dissipation plate is connected to a lower portion of the heat sink body. A protrusion protruding away from the heat sink body is disposed on a portion of a second surface of the heat dissipation plate opposite to the first surface. The protrusion is formed by stamping or bending the heat dissipation plate away from the heat sink body from the first surface of the heat dissipation plate.


Find Patent Forward Citations

Loading…