Shanghai, China

Hongqiang Han

This inventor holds 24 USPTO granted patents and 1 published patent application, primarily in Connector Technology. Top assignees: Tyco Electronics (Shanghai) Co., Ltd., Te Connectivity Corporation, Tyco Electronics (Zhuhai) Ltd. Active years: 2016-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hongqiang Han. Retrieved from https://idiyas.com/inventor/hongqiang-han

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 24 

% Patents Active = 95.8

Average Co-Inventor Count = 5.1

ph-index = 4

Forward Citations = 57(Granted Patents)


Company Filing History:


Years Active: 2016-2024

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Areas of Expertise:
Heat Sink
Connector Housing
Connector Assembly
Thermal Transfer
Shielding Sheet
Electrical Equipment
Cage Assembly
Clamping Mechanism
Radiator
Elastic Clip
Receptacle Assembly
Conductive Housing
24 patents (USPTO):Explore Patents

Title: Inventor Hongqiang Han

Introduction: Hongqiang Han is a renowned inventor based in Shanghai, China, known for his groundbreaking innovations in various fields.

Latest Patents: Hongqiang Han holds several patents in the areas of technology, healthcare, and sustainable energy, showcasing his diverse range of expertise.

Career Highlights: Throughout his career, Hongqiang Han has been recognized for his exceptional problem-solving skills and ability to think outside the box, leading to the development of cutting-edge solutions that have had a significant impact on industries worldwide.

Collaborations: Hongqiang Han has collaborated with leading research institutions, universities, and companies to further his inventions and bring them to market, demonstrating his commitment to driving innovation through strategic partnerships.

Conclusion: Hongqiang Han's passion for innovation and dedication to pushing the boundaries of what is possible make him a standout figure in the world of inventors, with a legacy that continues to inspire future generations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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