The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
Sep. 30, 2019
Applicant:
Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;
Inventors:
WenYu Liu, Shanghai, CN;
Lei Liu, Shanghai, CN;
Hongqiang Han, Shanghai, CN;
Jiwang Jin, Shanghai, CN;
Yan Lee, Shanghai, CN;
Zhicheng Li, Shanghai, CN;
Assignee:
Tyco Electronics (Shanghai) Co., Ltd., Shanghai, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 3/04 (2006.01); H01R 12/58 (2011.01); H01R 13/46 (2006.01); H01R 13/6581 (2011.01);
U.S. Cl.
CPC ...
F28F 3/04 (2013.01); H01R 12/58 (2013.01); H01R 13/46 (2013.01); H01R 13/6581 (2013.01); F28F 2280/00 (2013.01);
Abstract
A heat sink includes a heat sink body having a plurality of stacked fins and a mounting base. The mounting base has a first heat dissipation plate and a second heat dissipation plate. A first surface of the first heat dissipation plate is connected to a bottom of the heat sink body. The second heat dissipation plate is mounted on a second surface of the first heat dissipation plate opposite to the first surface.