logo

For the Inventor, By the Inventor

Berwyn, PA, United States of America

Te Connectivity Corporation

Calculating rank
USPTO Granted Patents = 670

% Expired Patents = 12.5



Trademarks = 103

Forward Citations = 3,719

Loading Chart...
Loading Chart...

605 inventors (with patents filed for the assignee):

goldMedal Michael John Phillips (51 out of 126 patents)

silverMedal Dandan Zhang (45 out of 80 patents)

bronzeMedal Chad William Morgan (43 out of 134 patents)

4.  Randall Robert Henry (38 out of 94 patents)

5.  Lvhai Hu (30 out of 69 patents)

6.  Justin Dennis Pickel (29 out of 51 patents)

7.  Roberto Francisco-Yi Lu (26 out of 114 patents)

8.  Michael David Herring (23 out of 54 patents)

9.  John Joseph Consoli (23 out of 76 patents)

10.  Yun Liu (22 out of 51 patents)

11.  Timothy Robert Minnick (19 out of 51 patents)

12.  Brian Patrick Costello (18 out of 101 patents)

13.  Yingcong Deng (17 out of 46 patents)

14.  Matthew Edward Mostoller (17 out of 80 patents)

15.  Alex Michael Sharf (16 out of 66 patents)


Core Competencies:
Electrical Connectors
Cable Assemblies
Thermal Management
Sensor Systems
Positioning Devices
Crimping Devices
Soldering Systems
Fluid Measurements
Communication Systems
Optical Ribbon Cables
High-Speed Connectors
Calibration Systems

670 patents:

1. 11462877 - Die clearance monitoring system for a crimping device (2022-10-04),
2. 11403743 - Cable detection apparatus (2022-08-02),
3. 11382250 - Positioning device (2022-07-05),
4. 11372057 - Flexible flat cable testing system (2022-06-28),
5. 11362472 - Terminal extraction tool (2022-06-14),
6. 11351622 - Laser soldering system (2022-06-07),
7. 11296474 - Flexible strip assembly system (2022-04-05),
8. 11259444 - Connector and connector cage with elastic clip (2022-02-22),
9. 11204603 - Terminal insertion quality monitoring system (2021-12-21),
10. 11179834 - Elastic sealing ring expanding apparatus (2021-11-23),
11. 11175236 - Image acquisition system and image acquisition method (2021-11-16),
12. 11159003 - Method of removing foil shield from cable (2021-10-26),
13. 11156491 - Inductive sensor assembly for fluid measurements (2021-10-26),
14. 11134600 - Assembly system (2021-09-28),
15. 11133607 - Electrical connection assembly, method of electrically connecting a conductor of a cable with a metallic textile (2021-09-28),
Company Overview
Te Connectivity Corporation, headquartered in Berwyn, PA, specializes in the development and manufacturing of advanced electrical connectors and cable assemblies. The company focuses on a wide range of technology domains, including thermal management, sensor systems, and positioning devices. Te Connectivity's expertise extends to crimping and soldering systems, as well as fluid measurement solutions, serving various industries such as automotive, industrial, and telecommunications. Their innovative products are designed to enhance connectivity and performance in complex applications.
Profile summary synthesized from public USPTO records and patent filings.

logo

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

Te Connectivity Corporation USPTO Patent Assignee Logo
670 Patents

#3 in Berwyn, PA

#29 in Pennsylvania

#748 in US

#1,485 in the World

Berwyn, PA (US)
Berwyn, PA, United States of America

Te Connectivity Corporation

Forward Citations = 3,719

605 inventors:

goldMedal Michael John Phillips (51 out of 126 patents)

silverMedal Dandan Zhang (45 out of 80 patents)

bronzeMedal Chad William Morgan (43 out of 134 patents)

4.  Randall Robert Henry (38 out of 94 patents)

5.  Lvhai Hu (30 out of 69 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Te Connectivity Corporation. Retrieved from https://idiyas.com/company/te-connectivity

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…