The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2022

Filed:

Jun. 21, 2019
Applicant:

Te Connectivity Corporation, Berwyn, PA (US);

Inventors:

Richard R. Dobson, Jr., Palmyra, PA (US);

Matthew John Orlowski, Harrisburg, PA (US);

Assignee:

TE CONNECTIVITY CORPORATION, Berwyn, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 43/048 (2006.01); B30B 15/00 (2006.01);
U.S. Cl.
CPC ...
H01R 43/0488 (2013.01); B30B 15/0094 (2013.01); H01R 43/0482 (2013.01); Y10T 29/53235 (2015.01);
Abstract

A die clearance monitoring system includes a light source, a light detector, and a controller. The light source is disposed along a front side of a die set of a crimping device and emits light towards the die set. The die set includes a first crimp die and a second crimp die that engage and crimp an object along a crimp stroke. The light detector is disposed along a rear side of the die set. The light detector receives the emitted light from the light source that traverses across the die set through a gap defined between the first and second crimp dies and generates light absorption data based on the emitted light that is received. The controller is communicatively connected to the light detector. The controller processes the light absorption data to determine a relative spacing between the first crimp die and the second crimp die.


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