The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Feb. 15, 2019
Te Connectivity Corporation, Berwyn, PA (US);
Tyco Electronics Canada Ulc, Markham, CA;
Te Connectivity Germany Gmbh, Bensheim, DE;
Te Connectivity India Private Limited, Bangalore, IN;
Tyco Electronics NZ Limited, Auckland, NZ;
Yiyang Liew, Winston Salem, NC (US);
Earl Daniel Swope, Kernersville, NC (US);
Christopher Couch, Troy, MI (US);
Lucian Iordache, Woodbridge, CA;
Tobias Becker, St. Leon-Rot, DE;
Kiranpal Singh, Mysore, IN;
Mathias Michael, Auckland, NZ;
Oliver Schaaf, Lustadt, DE;
TE CONNECTIVITY CORPORATION, Berwyn, PA (US);
TYCO ELECTRONICS CANADA ULC et al., Markham, CA;
Abstract
A sensor assembly that includes a sealed housing. A printed circuit board assembly including a first section that includes processing circuitry is disposed within the sealed housing and a second section that includes detection circuitry extends from the sealed housing. The sensor assembly also includes a conductive target movably coupled to the second section of the printed circuit board to vary net voltage of the detection circuitry as the conductive target moves along the second section to provide an output signal. The processing circuitry detects the output signal and converts the output signal into a linear representation of position of the conductive target in relation to the second section.