The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Aug. 11, 2016
Applicants:

Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;

Tyco Electronics Corporation, Berwyn, PA (US);

Tyco Electronics (Dongguan) Ltd, Guangdong, CN;

Inventors:

Hongzhou Shen, Shanghai, CN;

Dandan Zhang, Shanghai, CN;

Roberto Francisco-Yi Lu, Bellevue, WA (US);

George J. Dubniczki, Mechanicsburg, PA (US);

Qinglong Zeng, Guangdong, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/005 (2006.01); B23K 26/08 (2014.01); B23K 20/00 (2006.01); B23K 26/00 (2014.01); H05K 3/34 (2006.01); B23K 3/08 (2006.01); B23K 101/32 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0056 (2013.01); B23K 3/087 (2013.01); B23K 20/004 (2013.01); B23K 26/009 (2013.01); B23K 26/0884 (2013.01); H05K 3/3494 (2013.01); B23K 2101/32 (2018.08); B23K 2101/42 (2018.08); H01L 2224/78 (2013.01); H05K 3/3421 (2013.01); H05K 3/3489 (2013.01); H05K 2201/10287 (2013.01); H05K 2203/107 (2013.01);
Abstract

A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.


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