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For the Inventor, By the Inventor

Hsinchu, Taiwan

Wen-Yu Ho

This inventor holds 5 USPTO granted patents. Top assignees: Mosel Vitelic Corporation, Worldwide Semiconductor Manufacturing Corporation, Worldwide Semiconductor Mfg. Corp.. Active years: 1999-2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Yu Ho. Retrieved from https://idiyas.com/inventor/wen-yu-ho

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 5

% Patents Active = 100.0

Average Co-Inventor Count = 3.9

ph-index = 3

Forward Citations = 30(Granted Patents)


Location History:

  • Yeong-Kang, TW (2000)
  • Tainan, TW (2000)
  • Hsinchu, TW (1999 - 2001)

Company Filing History:

goldMedal3 out of 443 
 
Mosel Vitelic Corporation
 patents
silverMedal1 out of 112 
 
Worldwide Semiconductor Manufacturing Corporation
 patents
bronzeMedal1 out of 4 
 
Worldwide Semiconductor Mfg. Corp.
 patents

Years Active: 1999-2001

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5 patents (USPTO):Explore Patents
1. 6228753 - Method of fabricating a bonding pad structure for improving the bonding pad surface quality (2001-05-08),
2. 6096645 - Method of making IC devices having stable CVD titanium nitride films (2000-08-01),
3. 6030893 - Chemical vapor deposition of tungsten(W-CVD) process for growing low (2000-02-29),
4. 6022800 - Method of forming barrier layer for tungsten plugs in interlayer (2000-02-08),
5. 5966626 - Method for stabilizing a silicon structure after ion implantation (1999-10-12),

Title: Innovations of Inventor Wen-Yu Ho

Introduction

Wen-Yu Ho is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on improving the quality and stability of integrated circuit devices.

Latest Patents

One of his latest patents is a method of fabricating a bonding pad structure for improving the bonding pad surface quality. This method involves forming a passivation layer on a bonding pad, followed by a sacrificial layer that exposes the bonding pad. A Cu/Al alloy is then applied to cover the bonding pad, and the sacrificial layer is removed, leaving the alloy on the bonding pad. Another significant patent is related to making IC devices with stable CVD titanium nitride films. This method treats the as-deposited nitride film with a high power density plasma to enhance its stability against changes in resistance and thickness.

Career Highlights

Wen-Yu Ho has worked with prominent companies in the semiconductor industry, including Mosel Vitelic Corporation and Worldwide Semiconductor Manufacturing Corporation. His experience in these organizations has contributed to his expertise in semiconductor fabrication techniques.

Collaborations

Throughout his career, Wen-Yu Ho has collaborated with several professionals, including Yung-Tsun Lo and Sung-Chun Hsieh. These collaborations have likely enriched his research and development efforts in the semiconductor field.

Conclusion

Wen-Yu Ho's innovative approaches and patents have significantly impacted the semiconductor industry. His work continues to influence advancements in integrated circuit technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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