Taipei, Taiwan

Wen Yao Chang

This inventor holds 4 USPTO granted patents and 9 published patent applications. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Other. Active years: 2003-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen Yao Chang. Retrieved from https://idiyas.com/inventor/wen-yao-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4 

% Patents Active = 25.0

Average Co-Inventor Count = 1.5

ph-index = 2

Forward Citations = 21(Granted Patents)


Company Filing History:


Years Active: 2003-2019

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4 patents (USPTO):Explore Patents

Title: Innovations of Inventor Wen Yao Chang

Introduction

Wen Yao Chang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of circuit board technology, holding a total of 4 patents. His work focuses on innovative methods for forming circuit boards with silicon substrates.

Latest Patents

Chang's latest patents include a circuit board with a substrate made of silicon. This invention features a silicon substrate, an adhering layer that acts as a gluing layer, and a metal layer that can be formed as either a metal plate layer or a metal circuit layer. The metal layer is adhered to the adhering layer. Additionally, he proposes methods for forming the circuit board suitable for etching and screen printing.

Career Highlights

Throughout his career, Wen Yao Chang has worked with Taiwan Semiconductor Manufacturing Company Limited, where he has further honed his skills in semiconductor technology and circuit board design.

Collaborations

Chang has collaborated with notable coworkers, including Chih-Cheng Lu and Syun-Ming Jeng, who have contributed to his innovative projects.

Conclusion

Wen Yao Chang's contributions to circuit board technology and his innovative patents highlight his role as a significant inventor in the field. His work continues to influence advancements in semiconductor manufacturing and circuit design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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