The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Dec. 14, 2017
Applicant:
Wen Yao Chang, Taipei, TW;
Inventor:
Wen Yao Chang, Taipei, TW;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/12 (2006.01); H05K 1/09 (2006.01); H05K 3/32 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); H05K 1/09 (2013.01); H05K 1/186 (2013.01); H05K 3/1216 (2013.01); H05K 3/32 (2013.01); H05K 2203/0502 (2013.01);
Abstract
A circuit board with a substrate made of silicon includes a silicon substrate made of silicon; an adhering layer which is a gluing layer and is adhered on the silicon substrate; and a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer. Furthermore, the method for forming the circuit board with silicon substrate is proposed, in that a method for forming a circuit board suitable for etching and a method for forming a circuit board for screen printing are proposed.