Wen-Lun Lo

Title: Innovations of Wen-Lun Lo

Introduction

Wen-Lun Lo is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of packaging technology, holding a total of three patents. His work focuses on innovative methods for manufacturing coreless package structures and packaging substrates.

Latest Patents

Wen-Lun Lo's latest patents include a coreless package structure and a method for manufacturing the same. This invention involves providing a supporting substrate with an etching resist layer and a copper foil. A groove is defined in the copper foil, and contact pads are formed on its surface. A chip with electrode pads is placed in the groove, and a packaging layer is formed on one side of the copper foil. An insulating layer and a conductive pattern layer are subsequently formed, ensuring electrical connections through conductive bumps. The etching resist layer and copper foil are then removed to achieve the coreless package structure. Another patent focuses on a packaging substrate that includes a circuit board, first and second conductive posts, and a first conductive pattern layer. The design allows for enhanced electrical connectivity and structural integrity.

Career Highlights

Wen-Lun Lo is currently employed at Zhen Ding Technology Co., Ltd., where he continues to innovate in the field of electronic packaging. His expertise has led to advancements that improve the efficiency and effectiveness of packaging technologies.

Collaborations

Wen-Lun Lo collaborates with talented individuals such as Yong Ha Woo and E-Tung Chou, contributing to a dynamic work environment that fosters innovation.

Conclusion

Wen-Lun Lo's contributions to packaging technology through his patents demonstrate his commitment to innovation and excellence in his field. His work continues to influence the industry and pave the way for future advancements.