The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Jul. 15, 2014
Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;
Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;
Abstract
A coreless package structure and a method for manufacturing same includes the steps of providing a supporting substrate comprising an etching resist layer and a copper foil. A groove is defined in the copper foil and a plurality of contact pads are formed on the surface of the copper foil. A chip including a plurality of electrode pads is received in the groove and a packaging layer is formed on a side of the copper foil. An insulating layer and a conductive pattern layer are formed on the packaging layer in that order, the conductive pattern layer being electrically connected to the contact pads and the electrode pads by a plurality of conductive bumps. Finally, the etching resist layer and the copper foil are removed to obtain a coreless package structure.