Yong Ha Woo

Title: The Innovative Contributions of Yong Ha Woo

Introduction

Yong Ha Woo is a notable inventor based in Kwangmyung, South Korea. He has made significant contributions to the field of technology, particularly in packaging structures and methods. With a total of three patents to his name, Woo continues to push the boundaries of innovation.

Latest Patents

One of his latest patents is titled "Coreless package structure and method for manufacturing same." This invention involves a coreless package structure that includes a supporting substrate with an etching resist layer and a copper foil. The process defines a groove in the copper foil, where a chip with multiple electrode pads is placed. A packaging layer is formed on the copper foil, followed by an insulating layer and a conductive pattern layer, which connects the contact pads and electrode pads through conductive bumps. The final step involves removing the etching resist layer and copper foil to achieve the coreless package structure.

Another significant patent is "Packaging substrate, method for manufacturing same, and chip packaging structure having same." This patent describes a packaging substrate that consists of a circuit board, first conductive posts, and second conductive posts. The circuit board features a first base and a conductive pattern layer on its surface. The first conductive posts are connected to the conductive pattern layer, while the second conductive posts extend from the same layer, with their height being greater than that of the first posts.

Career Highlights

Yong Ha Woo is currently employed at Zhen Ding Technology Co., Ltd., where he applies his expertise in developing innovative packaging solutions. His work has been instrumental in advancing the technology used in electronic components.

Collaborations

Throughout his career, Woo has collaborated with talented individuals such as E-Tung Chou and Wen-Lun Lo. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Yong Ha Woo's contributions to the field of technology through his innovative patents and collaborations highlight his role as a leading inventor. His work continues to influence the industry and pave the way for future advancements in packaging technology.