The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Dec. 05, 2013
Applicant:

Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;

Inventors:

Yong Ha Woo, Kwang myung, KR;

E-Tung Chou, Taoyuan, TW;

Wen-Lun Lo, Taoyuan, TW;

Assignee:

Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/44 (2006.01); H05K 3/00 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0017 (2013.01); H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 25/105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15311 (2013.01); H05K 3/3436 (2013.01); H05K 3/4007 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/0379 (2013.01); H05K 2201/09836 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/0384 (2013.01);
Abstract

A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts.


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