Wen Hung

Title: The Innovations of Inventor Wen Hung

Introduction

Wen Hung is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative methods for manufacturing semiconductor memory devices.

Latest Patents

One of Wen Hung's latest patents is a method of manufacturing a semiconductor memory device. This invention includes a substrate, an isolation structure, a first gate dielectric layer, a first conductive layer, a second gate dielectric layer, a second conductive layer, and a protective layer. The substrate is designed with an array region and a periphery region, with the isolation structure positioned between these regions. The first gate dielectric layer is located in the array region, while the second gate dielectric layer is in the periphery region. The protective layer is strategically placed between the second conductive layer and the isolation structure. Another significant patent involves a method of fabricating a semiconductor device that includes two seal rings. This method outlines the formation of a first and second seal ring on a substrate, along with a protective layer that covers both seal rings.

Career Highlights

Wen Hung is currently employed at Winbond Electronics Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of memory devices, contributing to the overall progress in the electronics industry.

Collaborations

Wen Hung collaborates with talented individuals such as Chiang-Hung Chen and Yu-Kai Liao, who contribute to the innovative environment at Winbond Electronics Corporation.

Conclusion

Wen Hung's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence advancements in memory devices, showcasing the importance of innovation in technology.