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For the Inventor, By the Inventor

Hsinchu, Taiwan

Wen-Chung Liu

This inventor holds 16 USPTO granted patents and 1 published patent application. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Micro Mobio Corporation, Industrial Technology Research Institute. Active years: 1994-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Chung Liu. Retrieved from https://idiyas.com/inventor/wen-chung-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16 

% Patents Active = 81.3

Average Co-Inventor Count = 2.9

ph-index = 5

Forward Citations = 101(Granted Patents)


Location History:

  • Taichung City, TW (1994)
  • Da-Li City, Taichung Hsien, TW (1998)
  • Banchiau, TW (2004)
  • Taoyuan, TW (2005)
  • Kaohsiung, TW (2008 - 2012)
  • Hsinchu, TW (2002 - 2024)

Company Filing History:

goldMedal4 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal3 out of 65 
 
Micro Mobio Corporation
 patents
bronzeMedal2 out of 9,307 
 
Industrial Technology Research Institute
 patents
4. 1 out of 1 
 
Micro Mobio Corporation Taiwan Branch (USA)
 patent
5. 1 out of 2,114 
 
Winbond Electronics Corporation
 patents
6. 4 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 1994-2026

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16 patents (USPTO):Explore Patents
1. 12592488 - Antenna array panel for use in mobile devices (2026-03-31),
2. 12513951 - Gate structures in semiconductor devices (2025-12-30),
3. 12003044 - Antenna array for use in mobile devices (2024-06-04),
4. 11824281 - Surface mount antenna elements for use in an antenna array (2023-11-21),
5. 11774241 - Line edge roughness analysis using atomic force microscopy (2023-10-03),
6. 11404788 - Surface mount antenna elements for use in an antenna array (2022-08-02),
7. 11236996 - Line edge roughness analysis using atomic force microscopy (2022-02-01),
8. 10746542 - Line edge roughness analysis using atomic force microscopy (2020-08-18),
9. 8254489 - Transmission method and multiple input multiple output wireless communication system using the same (2012-08-28),
10. 7515627 - System and method for ultra-wideband (UWB) communication transceiver (2009-04-07),
11. 7356093 - Enhanced wireless communication system and method thereof (2008-04-08),
12. 6928308 - Mobile phone hand-free extension device (2005-08-09),
13. 6762482 - Memory device with composite contact plug and method for manufacturing the same (2004-07-13),
14. 6368910 - Method of fabricating ruthenium-based contact plug for memory devices (2002-04-09),
15. 5797812 - Shock-absorbing structures for rackets (1998-08-25),

Title: Inventor Wen-Chung Liu: Revolutionizing Technology in Hsinchu

Introduction: Wen-Chung Liu is a pioneering inventor based in Hsinchu, Taiwan, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Liu's recent patents focus on advancements in semiconductor technology, artificial intelligence applications, and renewable energy solutions, showcasing her versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Wen-Chung Liu has held key roles in leading tech companies, driving research and development initiatives that have led to numerous successful inventions and patents.

Collaborations: Liu has collaborated with top research institutions and universities in Taiwan, fostering a culture of innovation and knowledge-sharing that has resulted in impactful technological advancements.

Conclusion: Wen-Chung Liu's dedication to pushing the boundaries of technology and her commitment to innovation make her a standout figure in the world of inventors, with a legacy that continues to inspire future generations of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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