Company Filing History:
Years Active: 2025
Title: Wei-Jhan Tsai: Innovator in Semiconductor Packaging
Introduction
Wei-Jhan Tsai is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding two patents that showcase his innovative approach to technology.
Latest Patents
His latest patents include a package structure and manufacturing method that features a semiconductor die, an encapsulant, a redistribution structure, and a through insulating via. The first redistribution structure consists of an insulating layer and a circuit layer, with the semiconductor die positioned on top. This die includes a semiconductor base, through semiconductor vias, a dielectric layer, and bonding connectors. The design ensures that the dielectric layer is bonded with the insulating layer, while the bonding connectors link to the circuit layer's bonding pads. Another patent describes a package structure that incorporates a first redistribution circuit structure, a semiconductor die, a connecting film, and a second redistribution circuit structure. This innovative design allows for efficient thermal coupling and electrical connections between the semiconductor die and the circuit structures.
Career Highlights
Wei-Jhan Tsai is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on advancing packaging technologies that enhance the performance and reliability of semiconductor devices.
Collaborations
He collaborates with notable colleagues such as Sheng-Feng Weng and Ming-Yu Yen, contributing to a dynamic team that drives innovation in semiconductor technology.
Conclusion
Wei-Jhan Tsai's contributions to semiconductor packaging through his patents reflect his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.