Wei-Hsiang Tu

Title: Innovations of Wei-Hsiang Tu

Introduction

Wei-Hsiang Tu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Wei-Hsiang Tu's latest patents include innovative designs for semiconductor devices. One of his patents describes a semiconductor device that features a semiconductor die, a first conductive pad, a second conductive pad, and both first and second connector structures. The design ensures that the first connector structure has a lateral dimension greater than that of the first conductive pad, while the second connector structure has a smaller lateral dimension than the second conductive pad. Another patent details a semiconductor die that comprises a semiconductor substrate, an interconnect structure, and a conductive bump. The interconnect structure is intricately designed with stacked interconnect layers, each containing a dielectric layer and embedded interconnect wiring.

Career Highlights

Wei-Hsiang Tu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the field.

Collaborations

Throughout his career, Wei-Hsiang Tu has collaborated with notable colleagues, including Chien-Hao Hsu and Kuo-Chin Chang. These collaborations have fostered innovation and have been instrumental in the development of new technologies.

Conclusion

Wei-Hsiang Tu's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in semiconductor devices, showcasing the importance of innovation in technology.