Gunma, Japan

Wei Feig Qu


Average Co-Inventor Count = 3.9

ph-index = 3

Forward Citations = 28(Granted Patents)


Location History:

  • Gunma, JP (2005 - 2007)
  • Annaka, JP (2005 - 2013)

Company Filing History:


Years Active: 2005-2013

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6 patents (USPTO):Explore Patents

Title: Innovations of Wei Feig Qu

Introduction

Wei Feig Qu is a notable inventor based in Gunma, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on methods that enhance the production and efficiency of semiconductor devices.

Latest Patents

Wei Feig Qu's latest patents include a semiconductor substrate having a multilayer film and a method to reuse the substrate by delaminating a porous layer. This innovative method involves producing a semiconductor wafer with a multilayer film through a series of steps, including the formation of a porous layer and a semiconductor film. The process allows for the reuse of the semiconductor wafer after delaminating, which contributes to sustainability in semiconductor manufacturing. Another significant patent is a method of producing an annealed wafer, where a silicon single crystal wafer undergoes high-temperature heat treatment in a controlled atmosphere. This method effectively suppresses the growth of slip dislocations, thereby improving the quality of the wafer.

Career Highlights

Wei Feig Qu is currently employed at Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor industry. His work has been instrumental in advancing semiconductor technologies, making him a valuable asset to his organization.

Collaborations

Throughout his career, Wei Feig Qu has collaborated with esteemed colleagues such as Masaro Tamatsuka and Norihiro Kobayashi. These collaborations have further enriched his contributions to the field.

Conclusion

Wei Feig Qu's innovative work in semiconductor technology and his impressive portfolio of patents highlight his significant impact on the industry. His contributions continue to pave the way for advancements in semiconductor manufacturing and efficiency.

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