This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignees: Taiwan Semiconductor Manufacturing Co., Ltd., Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2025-2026.
Company Filing History:
1 out of 437 
1 out of 42,679 
Years Active: 2025-2026
Title: Innovations by Wei-Chun Pai
Introduction
Wei-Chun Pai is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit technology. With a total of 2 patents to his name, his work has had a considerable impact on the industry.
Latest Patents
Wei-Chun Pai's latest patents include innovative designs and methods for integrated circuit packages. One of his patents describes a device that features an integrated circuit die with a die connector, a dielectric layer, and an under-bump metallurgy layer. This design includes a through via with uniquely shaped sidewalls, enhancing the performance of integrated circuits. Another patent focuses on a method for reducing stress in circuit designs by utilizing a shifting contact pad. This method involves forming a polymer layer over metal pads and creating conductive vias that improve the reliability of the connections.
Career Highlights
Throughout his career, Wei-Chun Pai has worked with prominent companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company Limited. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies.
Collaborations
Wei-Chun Pai has collaborated with talented individuals such as Chun-Jen Chen and Cheng Wei Ho. These partnerships have fostered innovation and have led to the development of advanced technologies in the field.
Conclusion
Wei-Chun Pai's contributions to integrated circuit technology through his patents and collaborations highlight his role as a significant inventor in the industry. His work continues to influence advancements in semiconductor design and manufacturing.