This inventor holds 4 USPTO granted patents and 1 published patent application. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2016-2024.
Company Filing History:
Years Active: 2016-2024
Title: The Innovations of Wan-Ting Chiu
Introduction
Wan-Ting Chiu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work focuses on innovative manufacturing methods that enhance the efficiency and effectiveness of electronic device packages.
Latest Patents
Wan-Ting Chiu's latest patents include a manufacturing method for creating a package structure. This method involves providing a carrier with a specific design that includes a top surface and a lateral side surface. The process also entails forming an under layer on the carrier and a dielectric layer that covers the exposed flat portion. Another significant patent is for an electronic device package that features an encapsulated electronic component, a substrate, a conductor, and a buffer layer. This design ensures effective electrical connections between the substrate and the encapsulated electronic component.
Career Highlights
Wan-Ting Chiu is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in the semiconductor industry. His expertise in manufacturing methods has positioned him as a key player in the development of advanced electronic packaging solutions.
Collaborations
Throughout his career, Wan-Ting has collaborated with talented individuals such as Chia-Pin Chen and Chien-Fan Chen. These partnerships have contributed to the successful development of his patented technologies.
Conclusion
Wan-Ting Chiu's contributions to semiconductor packaging through his innovative patents demonstrate his commitment to advancing technology in this field. His work continues to influence the industry and pave the way for future innovations.