The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
May. 27, 2021
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Chia-Pin Chen, Kaohsiung, TW;
Chia Sheng Tien, Kaohsiung, TW;
Wan-Ting Chiu, Kaohsiung, TW;
Chi Long Tsai, Kaohsiung, TW;
Cyuan-Hong Shih, Kaohsiung, TW;
Yen Liang Chen, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A manufacturing method for manufacturing a package structure is provided. The manufacturing method includes: (a) providing a carrier having a top surface and a lateral side surface, wherein the top surface includes a main portion and a flat portion connecting the lateral side surface, and a first included angle between the main portion and the flat portion is less than a second included angle between the main portion and the lateral side surface; (b) forming an under layer on the carrier to at least partially expose the flat portion; and (c) forming a dielectric layer on the under layer and covering the exposed flat portion.