The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Apr. 20, 2015
Applicant:
Advanced Semiconductor Engineering, Inc., Kaosiung, TW;
Inventors:
Wan-Ting Chiu, Kaohsiung, TW;
Chien-Fan Chen, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaosiung, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 23/293 (2013.01); H01L 23/3171 (2013.01); H01L 24/08 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13023 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/35 (2013.01);
Abstract
The present disclosure relates to bonding structures useful in semiconductor packages. In an embodiment, a semiconductor device includes a semiconductor element and two pillar structures. The semiconductor element has a surface and includes at least one bonding pad disposed adjacent to the surface. The two pillar structures are disposed on the one bonding pad. The two pillar structures are symmetric and formed of a same material.