Company Filing History:
19 out of 1,870 
2 out of 277 Years Active: 2009-2025
Title: Innovations by Chien-Fan Chen in Electronic Device Packaging
Introduction
Chien-Fan Chen, based in Kaohsiung, Taiwan, is a prominent inventor in the field of electronic device packaging, holding an impressive portfolio of 20 patents. His work primarily focuses on advancements in semiconductor technology and embedded component packaging, which are vital for the miniaturization and efficiency of modern electronic devices.
Latest Patents
Among his latest innovations, Chen has developed two notable patents. The first is titled "Embedded Component Package Structure and Manufacturing Method Thereof." This patent details a manufacturing method that involves several precise steps, including the formation of a semi-cured first dielectric layer on a carrier, providing a component, and curing it through heat energies from both the top and bottom. The method culminates in the creation of a patterned circuit layer that is electrically connected to the embedded component.
The second invention, "Electronic Device Package and Method of Manufacturing the Same," describes an electronic device package that features a circuit layer consisting of a dielectric layer with an opening. This opening has a unique aperture design that widens toward the second surface, allowing for effective electrical contact with the electronic component placed on the second surface.
Career Highlights
Throughout his career, Chien-Fan Chen has contributed significantly to the semiconductor industry while working at renowned institutions like Advanced Semiconductor Engineering, Inc. and National Sun Yat-sen University. His role in these organizations has facilitated advancements in electronic device manufacturing processes, further establishing him as a leader in the field.
Collaborations
Chen has collaborated with notable colleagues, including Chien-Hao Wang and Yu-Ju Liao. These partnerships have fostered an environment of innovation, driving the development of new technologies and improving existing processes in electronic packaging.
Conclusion
Chien-Fan Chen's contributions to the field of electronic device packaging are significant, demonstrated through his numerous patents and collaborative efforts. His latest innovations not only enhance the functionality of electronic devices but also pave the way for future advancements in semiconductor technology. As technology continues to evolve, inventors like Chen play a crucial role in shaping the landscape of modern electronics.