Icheon-si, South Korea

Wan Choon Park

USPTO Granted Patents = 5 

Average Co-Inventor Count = 1.8

ph-index = 1

Forward Citations = 7(Granted Patents)


Location History:

  • Daejeon, KR (2015)
  • Icheon, KR (2015 - 2017)
  • Icheon-si, KR (2017 - 2023)

Company Filing History:


Years Active: 2015-2023

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5 patents (USPTO):Explore Patents

Title: Innovations of Wan Choon Park

Introduction

Wan Choon Park is a notable inventor based in Icheon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.

Latest Patents

One of his latest patents is titled "Semiconductor package including stacked semiconductor chips and method for fabricating the semiconductor package." This invention describes a semiconductor package that includes a second semiconductor chip with a through electrode and connection electrodes, allowing for efficient electrical connections between multiple semiconductor chips. Another recent patent is "Semiconductor packages including molded stacked die with terrace-like edges." This patent outlines a semiconductor package design that incorporates terrace-like edges to improve the structural integrity and performance of the semiconductor dies.

Career Highlights

Wan Choon Park is currently employed at SK Hynix Inc., a leading company in the semiconductor industry. His innovative designs and patents have contributed to the advancement of semiconductor technology, making him a valuable asset to his organization.

Collaborations

He has collaborated with several talented individuals, including Tae Ho Jo and Taek Joong Kim, who have worked alongside him in various projects.

Conclusion

Wan Choon Park's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to shape the future of semiconductor packaging and design.

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