The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Feb. 02, 2021
SK Hynix Inc., Icheon-si, KR;
Wan Choon Park, Icheon-si, KR;
Gyu Jei Lee, Icheon-si, KR;
Jong Hoon Kim, Icheon-si, KR;
Tae Hun Yi, Icheon-si, KR;
SK hynix Inc., Icheon-si, KR;
Abstract
A semiconductor package includes: a second semiconductor chip including a second through electrode that penetrates a second body portion and a second connection electrode that is connected to one end of the second through electrode; a first semiconductor chip stack disposed over the second semiconductor chip and including a plurality of first semiconductor chips, each of the plurality of first semiconductor chips includes a first through electrode and a first connection electrode connected to one end of the first through electrode; a molding layer; a third semiconductor chip disposed over the molding layer and the first semiconductor chip stack; and an external connection electrode electrically connected to an other end of the second through electrode, wherein, the second semiconductor chip and the plurality of first semiconductor chips are electrically connected through the second through electrode, the second connection electrode, the first through electrodes, and the first connection electrodes.